King Son PCB (Printed circuit board) Test Chambers and Solutions
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes, and other features (like wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it.
King Son is the prominent collaborative environmental test chamber and solution partner for key innovations in ICT industry since found 1983.
Through its OEM/ODM project partnership co-operation with Top 10 Taiwanese EMS (Electronic Manufacturing Services) giants accounting for 75% EMS business globally and leveraging the advantages of Taiwan’s critical role in making 90% of most advanced semi-conductor chips, King Son’s proprietary environmental test chamber and solution are uniquely positioned to play a leading role in the innovation value chain of established technology players like Apple, Dell and HP and upcoming disruptors within the
PCB（Printed circuit board）sector.
Rising Global Demand
The printed circuit boards (PCBs) market has experienced rapid growth in the last few years due to the increasing application of printed circuit boards (PCBs) in the electronics industry. The growing advances in consumer electronics and technological innovations in communications are likely to drive the growth of the printed circuit board market.
The increasing use of smartphones, tablets, laptops, and smart home devices drives the demand for printed circuit boards (PCBs). Increasing demand for energy-efficient products with cost-effective manufacturing and high performance is also expected to boost the growth of the market.
The increasing demand for the miniaturization of IoT devices, and increasing demand for compact electronic devices, including wearables, IoT devices, and medical devices, contribute to the growth of the printed circuit boards (PCBs) market.
To ensure its long-term use quality and reliability, PCB needs to conduct SIR (Surface Insulation Resistance) testing. Through this testing method, it can be found whether the Phenomenon of MIG (ion migration) and CAF (glass fiber yarn anode leakage) will occur on the PCB).
The Ion migration is happened in a humidified state (such as: 85°C/85%R.H.), applying a constant bias voltage (such as: 50V), in which the ionized metal moves to the opposite electrode (cathode to anode growth), and the opposite electrode is returned to the original metal and precipitation of dendritic metal phenomenon. Such phenomenon often causes a short circuit, and the ion migration is very fragile. The current generated at the moment when electrification will cause the ion migration itself to dissolve and disappear.
The testing standards for MIG and CAF are IPC-TM-650-2.6.14., IPC-SF-G18, IPC-9691A, IPC-650-2.6.25, MIL-F-14256D, ISO 9455-17, JIS Z 3284, JIS Z 3197... etc., but the testing time for one complete MIG and CAF test process takes usually 1000 hours, 2000 hours, which is not feasible for product development in R &D stage.
HAST (Highly Accelerated Stress Test) is a testing method used to increase the environmental stress (temperature, humidity, pressure ), in an unsaturated humidity environment (humidity: 85% R.H.) to speed up the test process and shorten the test time, to evaluate the PCB bonding and insulation resistance, and the moisture absorption effect of related materials, to shorten the testing time of high temperature and high humidity (from original testing conditions 85%℃, 85%R.H., 1000 hours reduced to 110℃, 85%R.H. , 264 hours).
The HAST testing standards for PCB are JESD22-A110-B, JPCA-ET-01, JPCA-ET-08.
King Son Environmental Test Chambers and Solutions are ready for PCB (Printed circuit board) testing and development
◆ King Son THS Programmable Constant Temperature and Humidity Test Chamber (Standard Type)
◆ King Son TSC Thermal Stress Complex Test Chamber
◆ King Son ATSK Thermal Shock Tester (Air to Air Type)
◆ King Son HAST+ Highly Accelerated Stress Test Chamber
◆ King Son SIR Surface Insulation Resistance Measurement System (SIR-2006B-250V)
King Son offers temperature and humidity testing chambers that aid in determining reliability of the product based on rigorous conditions it may be prone to due to temperature conditions.
For example, the novel King Son VMR series (VMR-S, VMR-F, VMR-3A) evaluation system and SIR measurement system can conduct the customization design integration test either with King Son made or 3rd party brand Temperature Cycling Test Chamber, Thermal Shock Test Chamber, HAST+ Highly Accelerated Stress Test Chamber, Constant Temperature and Humidity Test Chamber or Electric-dynamic Shaker.
The VMR series (VMR-S, VMR-F, VMR-3A) evaluation system in each interaction test maximum can integrate with up to 8 test chambers.
The SIR measurement system in each interaction test maximum can integrate with up to 5 test chambers.
King Son THS Programmable Constant Temperature and Humidity Test Chamber + King Son SIR Surface Insulation Resistance Measurement System
King Son THS + SIR integration test is designed to conduct high-temperature and high-humidity 85℃/85% RH for product life aging test, the product under THS + SIR test becomes brittle, and its characteristics decline.
King Son SIR is a scanning type designed Surface Insulation Resistance Measurement System(SIR-2006B-250V) that can expand the migration measurement up to 200 channels and breaks through the limits that the traditional scanning surface insulation resistance measurement system cannot records the migration ending time and also cannot records the happened time of migration, that customers can get the maximum production benefit with the least minimum equipment cost.
King Son TSC Thermal Stress Complex Test Chamber interaction test with King Son VMR-S Conductor Resistance Evaluation System – Standard
King Son TSC + VMR-S integration test is applicable for various automotive electronics materials, parts, and components soldering joints tests includes fixed-point temperature test, high temperature and high humidity test, high and low temperature thermal shock test, high and low temperature rapid temperature cycle test, highly accelerated life aging test, and various environmental reliability tests.
King Son TSC + VMR-S integration test is capable to conduct environmental reliability tests for automotive electronics material, parts, and components such as FPC, PCBA, resistors, inductors, capacitors, BGA & CSP solder joints, and advanced semiconductor packaging tests (Sip, SoC, WLP, PLP, FOWLP, 3D-IC, FCin MCep, FCBGA, Fc CSP, etc.) that assist customers to analyze the parts, components soldering joints reliability evaluation in the finished product quickly and effectively.
King Son HAST+ Highly Accelerated Stress Test Chamber interaction test with King Son SIR Surface Insulation Resistance Measurement System
King Son HAST + interaction test with King Son SIR is designed to provide high humidity 85% R.H, increase the test temperature and pressure to accelerate the aging test of automotive electronics parts, components, materials and shorten the test time of life test.
King Son SIR Surface Insulation Resistance Measurement System interaction test with King Son THS Programmable Constant Temperature and Humidity Test Chamber, ATSK Thermal Shock Test Chamber, HAST+ Highly Accelerated Stress Test Chamber
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King Son THS Programmable Constant Temperature and Humidity Test Chamber
[Online Catalog]
King Son THS Programmable Constant Temperature and Humidity Chamber is designed to carry out condensation and dew condensation tests for automotive electronics and damp heat temperature cycle test, combined temperature and humidity cycle test, humidity resistance test for electric vehicles.
Test standards: ISO16750, LV 124, AECQ-200, IEC60068-2], besides that, the accelerated aging test, temperature gradient test, Specify temperature change rate temperature cycle test, heat soak temperature cycle test are also included to meet the test requirements for Automotive and Vehicle Electronics.
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King Son TSC Thermal Stress Complex Tester
[Online Catalog]
King Son TSC Thermal Stress Complex Tester is designed to conducts the test requirements of ISO16750 (including temperature cycle test, rapid temperature change test with specified conversion time), LV124 (include temperature rise and fall operation test, temperature cycle test, temperature shock test), and AECQ-100, AECQ-200 tests (include [TC] temperature cycle test, [PTC] power temperature cycle test), AECQ-200 thermal shock and other rapid temperature cycle test (4 ~ 30 ℃/min). -
King Son ATSK Thermal Shock Tester(Air to Air Type)
[Online Catalog]
The Advanced Thermal Shock(ATSK)chamber is more advanced than before. Lower times of defrosting saves the time and energy. It can also control ramp rate via expansion. Design for the basic of international standards, it is stable and reliable for testing. -
King Son HAST+ Highly Accelerated Stress Test Chamber
[Online Catalog]
King Son HAST+ Highly Accelerated Stress Test Chamber is designed to conduct constant high-humidity environment (85% R.H.) test, which increase the temperature and pressure, and perform accelerated life tests [JESD22-A110, JESD22-A118] for automotive electronics parts, compoents and materials, effectively shortening the traditional high-temperature and high-humidity test time [JESD22-A101], It can also perform forced moisture absorption and destructive tests under high pressure (100% R.H.) [JESD22-A102].
Industry Integration Test
King Son THS Programmable Constant Temperature and Humidity Test Chamber + King Son SIR Surface Insulation Resistance Measurement System
King Son THS + SIR integration test is designed to conduct high-temperature and high-humidity 85℃/85% RH for product life aging test, the product under THS + SIR test becomes brittle, and its characteristics decline.
King Son TSC Thermal Stress Complex Tester + King Son VMR-S Conductor Resistance Evaluation System - Standard
King Son TSC + VMR-S integration test is designed to conduct high-speed measurement, recording, and data analysis for various electronic parts, components, materials, and its soldering joints tests.
King Son HAST+ Highly Accelerated Stress Test Chamber + King Son SIR Surface Insulation Resistance Measurement System
King Son HAST+ and SIR integration test is designed to provide high humidity 85% R.H, increase the test temperature and pressure to accelerate the aging test of automotive electronics parts, components, materials and shorten the test time of life test.
