Driven by the development of new technologies from electric vehicles, automotive electronics, smart sensors, 5G communication, wearable devices, High-Performance Computing (HPC), Generative Artificial Intelligence (AI), artificial intelligence (AI) and machine learning (ML) data center, cloud computing and storage etc., the global demands for advanced semiconductor manufacturing technology continues to increase rapidly.
King Son is the prominent collaborative environmental test chamber and solution partner for key innovations in ICT industry since found 1983.
Through its OEM/ODM project partnership co-operation with Top 10 Taiwanese EMS (Electronic Manufacturing Services) giants accounting for 75% EMS business globally and leveraging the advantages of Taiwan’s critical role in making 90% of most advanced semi-conductor chips, King Son’s proprietary environmental test chamber and solution are uniquely positioned to play a leading role in the innovation value chain of established technology players like Apple, Nvidia, NXP, ASE and upcoming disruptors within the semiconductor sector.
Semiconductors are crucial components of all emerging technologies from 5G networks to AI and green electricity. Semiconductor demand will continue to increase approximately 4-5% per year, with an estimated need for an increase in semiconductor manufacturing capacity of over 50% by 2030.
With the advanced technology development demands of electric vehicle and AI server, automotive electronics and AI server have many complicated data management and control systems. The electric vehicle control-systems have evolved from small isolated controllers to complex distributed computer-systems, in which the signals required between each module transmitted through many independent circuits.
To ensure these electronic components met the highest standards for operating resilience in high-temperature and high-heat running environments, The Automotive Electronics Council (AEC) released a set of standards, including the family members of the AEC Component Technical Committee - AEC-Q100 (for IC Chips), AEC-Q101 (for Discrete Components), AEC-Q102 (for Discrete Optoelectronic Components), AEC-Q103 (for MEMS, Microelectromechanical Systems), AEC-Q104 (for MCM, Multi-Chip Modules), and AEC-Q200 (for Passive Components).
AEC released the AEC-Q007 specification in March 2024, which is for automotive Board Level Reliability (BLR) testing, designed in conjunction with PCB that details the test methods for automotive PCB and daisy chain. It elaborates on PCB and Daisy Chain designs, with Daisy Chain design being the BLR board-level reliability test commonly heard in the industry.
The evolution of semiconductor manufacturing technology has also made integrated circuit electronic components size smaller.
The smaller the IC components size, the semiconductor product testing reliability such as warping, delamination, cracks and manufacturing process challenges begin to appear.
The requirements and strictness of semiconductor reliability testing, failure analysis and life estimation have also increased, that needs to conduct environmental simulation testing such as condensation, breathing, temperature and humidity combination, wet freezing, temperature cycle, etc.
The lifetime testing of IC components and parts is prolonged, and the testing time needs to be shortened effectively. Therefore, accelerated life and forced moisture absorption test must be carried out by PCT (Pressure Cooker Test), HAST (Highly Accelerated Temperature and Humidity Stress Test), uHAST (Unbiased Highly Accelerated Stress Test) testing.
King Son Test Chambers and Solutions for Semiconductor
With the properties of both a conductor and an insulator, a semiconductor is commonly found in most electronic devices, mainly software chips and batteries. Silicon is one of the most common materials labeled as a semiconductor. The quality of a semiconductor is determined by temperature and can be dramatically altered because of it. King Son offers temperature and humidity testing chambers that aid in determining reliability of the product based on rigorous conditions it may be prone to due to temperature conditions.
For example, the novel King Son VMR series (VMR-S, VMR-F, VMR-3A) evaluation system and SIR measurement system can conduct the customization design integration test either with King Son made or 3rd party brand Temperature Cycling Test Chamber, Thermal Shock Test Chamber, HAST+ Highly Accelerated Stress Test Chamber, Constant Temperature and Humidity Test Chamber or Electric-dynamic Shaker.
The VMR series (VMR-S, VMR-F, VMR-3A) evaluation system in each interaction test maximum can integrate with up to 8 test chambers.
The SIR measurement system in each interaction test maximum can integrate with up to 5 test chambers.
King Son TSC Thermal Stress Complex Test Chamber interaction test with King Son VMR-S Conductor Resistance Evaluation System – Standard
King Son TSC + VMR-S integration test is applicable for various automotive electronics materials, parts, and components soldering joints tests includes fixed-point temperature test, high temperature and high humidity test, high and low temperature thermal shock test, high and low temperature rapid temperature cycle test, highly accelerated life aging test, and various environmental reliability tests.
King Son TSC + VMR-S integration test is capable to conduct environmental reliability tests for automotive electronics material, parts, and components such as FPC, PCBA, resistors, inductors, capacitors, BGA & CSP solder joints, and advanced semiconductor packaging tests (Sip, SoC, WLP, PLP, FOWLP, 3D-IC, FCin MCep, FCBGA, Fc CSP, etc.) that assist customers to analyze the parts, components soldering joints reliability evaluation in the finished product quickly and effectively.
King Son HAST+ Highly Accelerated Stress Test Chamber interaction test with King Son SIR Surface Insulation Resistance Measurement System
King Son HAST + interaction test with King Son SIR is designed to provide high humidity 85% R.H, increase the test temperature and pressure to accelerate the aging test of automotive electronics parts, components, materials and shorten the test time of life test.
King Son SIR Surface Insulation Resistance Measurement System interaction test with King Son THS Programmable Constant Temperature and Humidity Test Chamber, ATSK Thermal Shock Test Chamber, HAST+ Highly Accelerated Stress Test Chamber
King Son THS Programmable Constant Temperature and Humidity Test Chamber + King Son SIR Surface Insulation Resistance Measurement System
King Son THS + SIR integration test is designed to conduct high-temperature and high-humidity 85℃/85% RH for product life aging test, the product under THS + SIR test becomes brittle, and its characteristics decline.
King Son TSC Thermal Stress Complex Tester + King Son VMR-S Conductor Resistance Evaluation System - Standard
King Son TSC + VMR-S integration test is designed to conduct high-speed measurement, recording, and data analysis for various electronic parts, components, materials, and its soldering joints tests.
King Son HAST+ Highly Accelerated Stress Test Chamber + King Son SIR Surface Insulation Resistance Measurement System
King Son HAST+ and SIR integration test is designed to provide high humidity 85% R.H, increase the test temperature and pressure to accelerate the aging test of automotive electronics parts, components, materials and shorten the test time of life test.